DSneXt Module :: Single Monitor, Wire-Wrap Front Cross-Connect, BNC Rear I/O

DSneXt™ :: The world's most comprehensive DSX system.

DSneXt™ modules provide an access point for non-intrusive patch, test, monitor and cross-connecting of DS1 circuits. Choose from three distinctive front cross-connects and four I/O backplanes, this modular solution provides a fully customizable platform to connect and manage data traffic in your networks. A monitor port allows access to the output signal of each circuit, giving you everything you need to install, grow or sunset your copper network.

Overview

• Flexible design allows you to add modules as your network grows
• Available in three distinctive front cross-connects (Wire-Wrap, IDC, RJ48)
• Choose from four I/O backplanes (Wire-Wrap, IDC, RJ48, BNC) to accommodate nearly any application
• Patented die-cast jacks outperform competitors' molded plastic jacks
• Removable single-circuit jack design lets you access individual circuits without impacting terminations
• Monitor jack allows access to the output of each circuit
• Dynamic LEDs provide visual indicators for immediate diagnostics
• NEBS certified and backed by Telect's industry-leading warranty

Specifications

• Single Monitor
• Front Cross-Connect: Wire-Wrap
• Rear I/O: BNC
• Module Weight: .6 lbs. (.27 kg)
• Shipping Weight: .7 lbs (.32 kg) 

Note: DSneXt™ consolidates three product lines (E64, E84 and SuperMix) into one solution.